While browsing the WindowsMobile blog archive, I found two articles describing what component or part of your PDA or smartphone (i.e. touchscreen, backlight, CPU, LED etc.) drains your battery most. Both articles are available here and here. The latter one also describes the difference in power management of smartphones and PDA’s.

According to this press release that was published recentely, the HTC Artemis uses a GPS chip GSC3 produced by the SiRF company. A datasheet and other technical information can be found here. Key parameters (as declared by the manufacturer) are the following:

• 140-ball grid array (BGA) with a pitch of 0.65 mm
• Pb free
• 7 mm x 10 mm x 1.4 mm
• SiRFstarIII™ GSP CoreDigital and RF in a single package
• 50-MHz ARM7TDMI processor plus 1 Mb SRAM
• SiRFLoc Client A-GPS multi-standard support
• 4 Mbit flash memory
• Low Power

Another part from the “Artemis inside” series deals with the WiFi technology. WiFi identifies itself in all applications and utilitis (e.g. vxUtil, PocketPCTools atd.) with the device name TNETWLN1. Actually, the TNETW label stands for a specific product line of WiFi chips made by Texas Instruments. Most likely, the TNETW1230 chip is used in HTC Artemis. The key features of this particular chip are the following (taken from the manufacturer datasheet):

• 1 mA standby power consumption
• can be combined with TI’s OMAP™ processors, GSM, GPRS and chipsets
• includes VLYNQ™, TI’s low power, low pin-count serial interface
• easily connects to TI’s BRF6100 and BRF6150 single-chip Bluetooth wireless technology solutions
• embedded station developers kit (eSTADK) for mobile 802.11g and 802.11a/g developments

More information about the TNETW1230 chip can be found je here.

One of the contributors at xda-developers published the pinout of the HTC ExtUSB connector that is used with the Artemis device. The pinout picture can be found here; link to that thread at the xda-developers can be found here.

This time it was not so difficult to find out the manufacturer of the FM radio chip that is used in the HTC Artemis. Actually, the factory is mentioned right in the user’s manual that comes in the box with the device. So it is the Si4701 made by Silicon Lab. More information can be found here.

Similar to HTC Wizard, it seems that Artemis has built-in the TCS3500 chipset, which is manufactured by Texas Instruments. The key advantage of TCS 3500 is all the wireless technology support (taken from the TI datasheet, link bellow):

• Complete pre-FTA certified, smartphone EDGE Class 12 reference design
• Applications including MPEG-4 video and Windows Media™ video, MP3, 2.0 megapixel camera,
• Software compatible with TCS2600 GSM/GPRS chipset
• Modules available for camera, A-GPS through TI’s TGS5000 chipset and high-speed WLAN through TI’s TNETW1230
• TI’s highly integrated BRF6150 Bluetooth wireless technology chipset based on TI’s patented DRP architecture
• High-level mobile OS support, including Symbian OS™ and Nokia S60, Microsoft® Windows Mobile™, Palm OS®, SavaJe OS and Linux

To make this post complete, it is important to say that the TCS3500 solution also includes the OMAP 850 CPU (datasheet available here).